Ultra low power temperature compensation method for palladium nanowire grid
Authors | Erik Puik , J.F. van der Bent , C.J.M. van Rijn |
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Published in | Procedia Engineering vol. 5 |
Publication date | 5 September 2010 |
Research groups | Microsystems Technology |
Type | Lecture |
Summary
From Science direct: One of the nanowires was covered with a 2-Hydroxyethyl methacrylate based compound to prevent hydrogen from reaching the wire. The compound was dried by a UV source and tested in chamber for comparison with previous measurements. The results shows that temperature effects can be reduced by a digital signal processing algorithm without measuring temperature near or at the substrate. With this method no additional temperature probes are necessary making this solution a candidate for ultra low power wireless applications.
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Language | English |
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Published in | Procedia Engineering vol. 5 |
Key words | DSP, Digital signal processing, Nanowire, Palladium, DEA, Amplifier, Ultra low power, Temperature compensation |
Page range | 184-187 |