Ultra low power temperature compensation method for palladium nanowire grid

Authors Erik Puik , J.F. van der Bent , C.J.M. van Rijn
Published in Procedia Engineering vol. 5
Publication date 5 September 2010
Research groups Microsystems Technology
Type Lecture

Summary

From Science direct: One of the nanowires was covered with a 2-Hydroxyethyl methacrylate based compound to prevent hydrogen from reaching the wire. The compound was dried by a UV source and tested in chamber for comparison with previous measurements. The results shows that temperature effects can be reduced by a digital signal processing algorithm without measuring temperature near or at the substrate. With this method no additional temperature probes are necessary making this solution a candidate for ultra low power wireless applications.

researchcomponents.publicationcontent.personslist.publicationauthors

  • Erik Puik
    Erik Puik
    • Professor
    • Research groups: Microsystems Technology

Language English
Published in Procedia Engineering vol. 5
Key words DSP, Digital signal processing, Nanowire, Palladium, DEA, Amplifier, Ultra low power, Temperature compensation
Page range 184-187

Erik Puik

Erik Puik

Erik Puik

  • Professor
  • Research group: Microsystems Technology